by Maarten Vraanes
Director of Consulting Services, MEMS Journal
MEMS packaging, as the entire MEMS ecosystem, is rapidly evolving. Technologies such as wafer level and 3D integration are becoming increasingly important. In this article, we outline our observations about the current and future trends of MEMS integration and packaging. Major trends focus on developing CMOS-compatible MEMS fabrication processes for monolithic integration, such as low-temperature wafer bonding. Another emerging trend is die stacking in low-cost leadless type semiconductor packaging -- these types of techniques provide smaller footprint packages with lower unit costs for high production volumes. Additionally, 3D integration enables the integration of LCR passives. Here, LCR components are embedded into the package itself to minimize external passives and accommodate smaller footprint applications, wafer bonding and vertical intra-package connectors or interposers. On the flip side, CMOS and 3D integration of MEMS devices pose challenges in modeling, testing, and reliability.