Micralyne, a MEMS foundry and sensors supplier, announced this week a collaboration with Microplex based in Placentia, California to develop and manufacture custom wafers with metal TSVs. The joint development of this technology leverages the specific expertise of each company to enable a metal TSV solution for sensor and semiconductor applications. The companies engaged in the development of the TSV offering in 2016 and are now offering full volume production capability.
"Microplex has a long history of supplying thru-via technology to various markets," said Clay Kucenas, President and CEO of Microplex. "Our partnership with Micralyne provides new access to fast growing sensor and MEMS applications driven by IoT, medical, and optical devices."
The companies have agreed to work jointly to deliver standalone TSV wafers as well as integrated TSV solutions with metal layers for interposer and redistribution layers. Micralyne will also offer multilayer wafer level packaging (WLP) with metal TSV technologies for ball grid array sensors.
According to the companies, minimum via hole diameters as small as 40um with 70um pitches are currently being fabricated. The diameter to depth ratio of the via holes can exceed 20:1 providing a flexible and robust wafer thickness. Conductive via fills are available in gold, silver, and copper metals. Optimized via processing and unique formulations assures effective performance in high frequency device applications while maintaining the purity of the base silicon microstructures.
"The ability to offer a metal TSV capability to sensor and MEMS applications is truly exciting," said Paul Pickering, Micralyne's Vice President of Business Development. "Dozens of opportunities come through Micralyne every year that need the performance and flexibility of this technology. Micralyne can now offer a world class solution for these applications."
Micralyne is one of the world's leading independent developers and manufacturers of MEMS and micro-fabricated products. Headquartered in Edmonton, Alberta, Canada, Micralyne's customer base includes Fortune 500 companies, mid-range industrial and biomedical companies, and startups. In January of 2015, Micralyne was acquired by FTC Technologies.
Microplex offers customized fabrication of "thru-via" products with expertise in high temperature metallized vias. Metallized vias can be processed in silicon, glass, alumina, and quartz substrate materials. Metallized fine diameter vias can be achieved in both wafers and panels. Conductive metals commonly utilized within the vias are copper, silver, and gold. Microplex supports prototype builds as well as moderate quantity volume production.
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