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by Maarten Vraanes Director of Consulting Services, MEMS Journal
MEMS packaging, as the entire MEMS ecosystem, is rapidly evolving. Technologies such as wafer level and 3D integration are becoming increasingly important. In this article, we outline our observations about the current and future trends of MEMS integration and packaging. Major trends focus on developing CMOS-compatible MEMS fabrication processes for monolithic integration, such as low-temperature wafer bonding. Another emerging trend is die stacking in low-cost leadless type semiconductor packaging -- these types of techniques provide smaller footprint packages with lower unit costs for high production volumes. Additionally, 3D integration enables the integration of LCR passives. Here, LCR components are embedded into the package itself to minimize external passives and accommodate smaller footprint applications, wafer bonding and vertical intra-package connectors or interposers. On the flip side, CMOS and 3D integration of MEMS devices pose challenges in modeling, testing, and reliability.
InvenSense, a leading provider of MEMS motion sensors claimed this week that it won its motion to stay the patent litigation action brought by STMicroelectronics in the US District Court (Northern District of California) due to progress in separate proceedings with the United States Patent Office (USPTO) challenging the validity of all of ST's asserted patents. InvenSense stated that all of ST's claims asserted in this litigation, initiated by ST, are now subject to USPTO reexamination proceedings. Reportedly, USPTO has already determined that "substantial questions of patentability" exist for seven of the nine patents asserted by ST, and USPTO office actions have already been issued for four of the patent reexamination requests. This patent dispute is yet another indication that the market for consumer grade MEMS based motion sensors has become ultra-competitive.
Tronics, a MEMS foundry and device maker, introduced this week a new high performance MEMS based angular rate sensor (gyro) for applications such as platform stabilization. The product is based on Tronics' MEMS-on-SOI and high vacuum wafer level packaging technologies. Tronics has been active in the design and manufacture of high performance MEMS gyros for more than 10 years. According to the company, the product aimed at a segment of the gyro market that is currently under-served and typically does not warrant custom development.
Intel's initiative to promote new features like indoor navigation and augmented reality in ultrabooks will spur dramatic growth in the sales of motion sensors for the next-generation notebook PCs, with revenue rising by a factor of 14 during the next four years. Global sales of motion sensors -- including accelerometers, gyroscopes and compasses -- used in ultrabooks will expand to $117.3 million by 2016, up from just $8.3 million in 2012. This equates to a compound annual growth rate (CAGR) of 93.9 percent for 2012 through 2016, according to the IHS iSuppli.
The entry-level 8GB version of Google's new Nexus 7 media tablet carries a bill of materials (BOM) of $151.75, according to preliminary findings from IHS iSuppli. When manufacturing expenses are added, the cost increases to $159.25. The high-end model with 16GB of flash memory has a $159.25 BOM, for a total cost of $166.75. When additional costs are considered, IHS iSuppli estimates that Google will at least break even on sales of the 8GB model, priced at $199 -- and will make a modest profit on the 16GB version, which is priced at $249.
Si-Ware Systems (SWS), a provider of IC and MEMS based solutions for industrial and consumer applications, announced this week that it has launched its inertial sensor development platform. According to the company, the platform is a tool for sensor developers that can be used to evaluate an inertial sensor, such as a gyroscope or accelerometer, to understand the behavior of the sensor and its performance with complete interface electronics. The platform utilizes SWS's inertial sensor interface ASIC which is configurable and reportedly has already been used in conjunction with multiple accelerometers and gyroscopes. Si-Ware said that the ASIC features an ultra-low noise front-end, and a highly configurable open and closed loop operation, as well as high voltage capabilities.
Gyroscopes were the top revenue generator in 2011 in the dominant consumer and mobile segment of the MEMS market, thanks to record sales of Apple's iPhone and iPad devices from during the final quarter of last year. Gyroscopes netted $655.4 million in 2011, up a notable 66 percent from $394.5 million in 2010, according to an IHS iSuppli report. Long a runner-up in its category, gyroscopes finally displaced accelerometers last year to become the revenue champion in consumer and mobile MEMS. Gyroscopes will continue to reap top revenue honors in the next few years, projected to take in $1.1 billion by 2015, well ahead of accelerometers at $705 million.
The design of ST's dual-core MEMS gyroscope employs separate output paths optimized for the two different functions in a 4x4x1 mm package. The device addresses, at the same time, motion and gesture recognition and optical image stabilization for sharper mobile camera photos. "ST's dual-core gyroscope lights two candles with one flame," said Benedetto Vigna, Corporate Vice President and General Manager of ST's Analog, MEMS and Sensors Group. "Instead of using two dedicated sensors with significantly different specifications, phone and tablet manufacturers can now simply integrate a single gyroscope for both gesture recognition and camera image stabilization, which enables more reliable performance, sleeker form factors, and lower costs."
Gentex and InterSense announced this week that Gentex has acquired substantially all assets of InterSense. Terms of the agreement were not disclosed. The agreement to acquire InterSense, a developer of MEMS based hybrid motion tracking systems, advances Gentex' growth strategy and expands the company's capabilities to address the growing demand for precision motion tracking and situational awareness capabilities in military and non-military markets.
MEMS inertial sensors, such as accelerometers and gyros, are some of the most challenging types of sensors to test because their characterization requires an extensive range of physical stimuli. We recently spoke with Sascha Revel, Director of Sales at ACUTRONIC about testing of inertial MEMS devices. As a company that mainly focuses on inertial sensor testing, ACUTRONIC's perspective is unique and offers valuable insights. In this interview, Mr. Revel discusses the main types of inertial MEMS tests, reliability requirements, key challenges and associated costs.
