Advanced packaging, especially at the wafer level, is becoming increasingly important for MEMS and 3D stacking applications. FlipChip International (FCI), based in Phoenix, Arizona, is one of the service providers in this segment. FCI is an interesting company because they compete with larger players such as ASE and Amkor. Plus, a big part of their operations is in China. We recently spoke with David Wilkie, FCI’s President and CEO, about his company’s current activities and challenges, recent marketplace dynamics, business threats and opportunities, and competitive landscape. David also discusses 2.5 and 3D packaging approaches based on through silicon via (TSV) and through glass via (TGV) substrate technologies.