MEMS Investor Journal -- The Largest MEMS Publication in the World

Overview of CMP technologies for MEMS applications

CMP, or chemical mechanical polishing, was developed in the late 1980s at least partially as a result of a secret IBM project at the time.  Although initially mainly used in CMOS processes, CMP is now increasingly being utilized by MEMS process flows.  We recently spoke with Dr. Robert Rhoades, CTO of Entrepix, about the history of CMP, current trends as well as traditional and emerging CMP MEMS applications.  In this  comprehensive interview, Robert also provides his insights on the current CMP cost trends and the emerging 3D stacking and TSV technologies.

MEMS foundry IMT adds to its arsenal of through silicon via offerings

Innovative Micro Technology (IMT) announced this week the addition of a new geometry point in its technology roadmap for through silicon vias (TSVs).  Joining the copper-filled 15 by 60 micron depth TSV configuration that has been in production for nearly 2 years, IMT has been sampling its 50 by 250 micron copper-filled TSV which is planned for production shortly after the first of the year.

Overview of wafer level packaging technology for MEMS applications

by Michael Shillinger
Vice President of Operations, Innovative Micro Technology

Wafer level packaging (WLP) technology offers protection of delicate MEMS structures from ambient environment, providing improved reliability, performance, and reduced cost benefits to meet real world requirements.  In simple terms, WLP consists of bonding a cap or a lid wafer on top of a MEMS wafer.  While aspects of WLP can be modular, some customization is necessary to meet the needs of each application, where such variables include device footprint, temperature budget, allowable materials, hermeticity, absolute pressure, and cost.  WLP technology is now widely used in the MEMS industry, and has contributed to mainstream acceptance of MEMS.

Lilliputian, Intel to partner on manufacturing

Lilliputian Systems, developer of a MEMS based portable power solution for consumer electronics devices, announced that it has signed a wafer manufacturing supply agreement with Intel.  Additionally, Lilliputian announced that Intel Capital has taken an equity stake in Lilliputian Systems.  "Intel recognizes that portable power solutions will be essential to consumer electronics devices and is committed to manufacturing Lilliputian's technology," said Brian Krzanich, SVP and GM of Manufacturing and Supply Chain for Intel Corporation.

Overview of glass micro machining processes for MEMS applications

by Dave Sarvela
Manager of Applied Technology, IKONICS Corporation

Glass is often considered a more desirable material for particular MEMS device applications due to its unique properties, such as optical transparency and biological compatibility.

As the desire to use glass in the MEMS industry increases, so does the need to develop better methods to micro-machine this material.  Traditional machining methods, such as CNC, are not very effective at machining brittle materials such as glass.  In addition, as the diversity of MEMS applications expands, the desired features continue to get smaller, denser and more intricate.

MEMS foundry Advanced MicroSensors to be acquired by Plures Technologies

Plures Technologies is in the final phase of acquiring and recapitalizing Advanced MicroSensors (AMS), an established high volume MEMS fabrication facility.  AMS offers a complete suite of MEMS processing capabilities and specific expertise in the use of magnetic films for MEMS and other applications.

Industry overview: a MEMS foundry perspective

As the MEMS marketplace continues to evolve at a rapid pace, many new and exciting trends are taking shape.  To provide some perspective, we recently spoke with Nancy Fares, Micralyne’s new President and CEO.  In this detailed interview, Nancy provides unique insights on the main current trends in the MEMS marketplace, venture capital, most promising MEMS startups as well as potential future “killer apps” for MEMS technologies.

MEMS foundry DALSA to expand R&D investment

DALSA Corporation, a manufacturer of digital imaging, MEMS and semiconductor components, announced this week that it plans to invest $160 million in new research and development initiatives over the next five years, supported by a grant of up to $24.3 million from the Ontario provincial government.

MEMS foundry ISSYS announces manufacturing expansion

Integrated Sensing Systems, Inc. (ISSYS) announced that it has completed its 2010 manufacturing expansion project, adding 5,400 square feet to its existing facility.  The expansion is dedicated to manufacturing of system-level products based on ISSYS MEMS chips that are fabricated in its current cleanroom facility.  The expansion includes assembly lines, production laboratories, clean assembly and packaging rooms as well as calibration areas for both medical and industrial products.  The new floor space also includes a combination cleanroom and Faraday cage for final assembly and calibration area with capacity for over 10,000 units per year of ISSYS' wireless, batteryless medical implants.  The company’s fabrication facilities are located near Ann Arbor, Michigan.

Groups partner on TSV process development for 3D MEMS and IC integration

EV Group (EVG), a supplier of wafer bonding equipment for the MEMS, nanotechnology and semiconductor markets, and the Institute of Microelectronics (IME), a research institute of the Agency for Science, Technology and Research (A*STAR), announced that they have entered into a two-year cooperation agreement to advance 3D IC integration technologies.  By minimizing interconnect length, 3D IC integration offers more flexibility in the designs and can operate at higher clock rates and consume less power.  The development in 3D IC also significantly simplifies chip-to-chip communications and the data transfer among the processing elements, enabling faster signal and data throughput so that high-frequency and high-transfer rates can be achieved.