by Jacopo Iannacci, Ph.D.
Researcher, Fondazione Bruno Kessler
In developing packaging solutions for MEMS and RF MEMS devices, one must take several considerations into account. First, the main task of the package is to offer adequate protection to the devices from harmful factors, such as mechanical shocks as well as moisture, dust particles, and various contaminants. Depending on devices types and on the operational environment, the packaged part should be robust with respect to the harmful external factors. Depending on the application, different materials can be utilized such as silicon, glass, and ceramics. For each type of material, one needs to apply different techniques to set up the electrical signal interconnection scheme as well as the necessary space to accommodate the devices to be packaged.