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Comments

Li Gang

According to the report, the die size of akustica is 3*3mm, which is too large and cost too much and cannot compete with traditional ECM on the cost. Besides, akustica use DRIE to etch through the whole wafer to improve microphone performance, while DRIE cost much.
Therefore, akuscita's microphone can only aims to high margin application. For cost sensitive low end mobile phone application, akustica's integrated microphone has little advantages than the compititors. Just personal view.

Davin Yuknis

While we are impressed with Dr. Li's interest in our technology, we found most of his information is quite dated. New technology development moves quickly, and old assumptions are quickly thrown out or disproved. Much has changed with our products since the time the white papers were written, and many of his arguements do not apply.

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