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Dr. MP Divakar

Excellent article overall! I agree Mil-STD-883G Method 1014.11 is not the one to be applied to wafer-level MEMS packaging.

Question to Mr.Shillinger are:

1. You seem to favor thermistor & Q measurement methods as cost-effective ways to test for hermiticity. For non-resonant sensing strutures in a design, one would have to build Q-measuring test structures. So thermistor measurement method is the fall-back for these devices?

2. Are there any off-settings needed for resistance vs. temperature dependency in the thermistor approach?

3. What is your experience with wafers tested for hermiticity, stored for several months & retested -any degradation in hermiticity with a given process?

Dr. MP Divakar

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