MEMS Journal -- The Largest MEMS Publication in the World

Pressure sensors to become top MEMS device by 2014

Due to their relatively high prices and expanding use in a host of automotive, medical and industrial applications, pressure sensors will become the leading MEMS device by 2014, according to IHS iSuppli.  Driven by a strong automotive industry recovery after the recession, pressure sensors last year generated $1.22 billion in revenue, up 26 percent from 2009, to reach second place in terms of revenue among all MEMS devices.  Growth this year will be more modest at 6.6 percent, but a double-digit expansion is predicted for 2012.  By 2014, revenue for MEMS pressure sensors will amount to $1.85 billion.

Bonding reliability testing for wafer level packaged MEMS devices

by Michael Shillinger
Vice President of Operations, Innovative Micro Technology

Devices, especially MEMS that have moving actuators, perform best inside the cleanroom.  When taken out of the cleanroom, particles can hinder or degrade the performance, and lead to device failure.  IMT, like many others in the industry, recognized the need to package these delicate devices at wafer level to ensure and optimize the device performance and shelf life.  With the advancement of wafer bonding technologies and equipment, many MEMS devices in the market today are packaged at wafer level.  At the same time, this progression has also led to the need for development of bond quality testing, especially useful for applications and devices that operate in either pressurized or vacuum environments.  The most accurate method to determine the quality of a bond is to test for package hermeticity, which consists of fine and gross leak testing.

Electronic compass market expected to grow at 73 percent in 2011

With navigation features becoming standard in smartphones like Apple's iPhone as well as in tablets and gaming devices, the market for electronic compasses is set to close this year with a sizable 73 percent growth, according to IHS iSuppli.  Global revenue for electronic compasses is expected to reach $419.1 million in 2011, up from last year's $242.3 million.  The hefty growth this year continues the explosive 186 percent surge seen by the market in 2010, with strong double-digit expansion assured for the next few years as well.  By 2015, revenue is projected to amount to $842.2 million, an increase of more than threefold from 2010.

Overview of wafer bonding techniques for MEMS applications

Wafer bonding is a critical part of most MEMS process flows.  Especially with the increased importance of wafer stacking and 3D technologies, selecting the best wafer bonding process will likely determine the cost structure, and therefore, the ultimate market success of many MEMS devices.  We recently spoke with Eric Pabo, MEMS Business Development Manager of EV Group, about trends and developments with bonding techniques for MEMS applications.  In this interview, Eric discusses the history of wafer bonding, emerging MEMS bonding techniques, equipment providers, and bonding process cost drivers.

Bio-Rad acquires QuantaLife's microfluidic technology for $162 million

Bio-Rad Laboratories, a manufacturer and distributor of life science research and clinical diagnostics products, announced this week that it has acquired QuantaLife, a microfluidic technology startup, for $162 million in cash plus potential future milestone payments.  QuantaLife raised $17.2 million in venture capital financing in December 2010.