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InvenSense, Sonion announce MEMS microphone development alliance

InvenSense, a provider of MEMS motion sensors and microphones for the consumer electronics market, and Sonion, a provider of micro acoustic solutions for hearing instruments, in-ear earphones and specialty headsets, announced this week a strategic alliance in which the two parties will cooperate in the development of MEMS microphones and related technologies for use in a broad range of hearing applications.  InvenSense will bring its MEMS knowledge, MEMS microphone portfolio and R&D resources to the partnership.  Sonion will contribute with its insights in development of high performance microphones, R&D resources and its specialized application engineering function addressing the hearing health market.

Bosch is top MEMS device maker in 2013

Bosch became the top manufacturer of MEMS sensors and actuators in 2013, pulling out of a virtual tie with STMicroelectronics the previous year, and making history in the process as the first company to reach $1 billion in market revenue, according to new analysis from IHS.  As the undisputed leader of the global MEMS industry last year, Bosch boasted revenue of $1 billion, up from $794 million in 2012.  It grew 26 percent during the year, four times more than the industry average, which allowed the German-based maker to leave behind its Italian-French rival after finishing neck and neck in 2012.  STM, meanwhile, suffered a 2 percent decline in revenue to $777 million, down from $794 million.

MEMS foundry Rogue Valley Microdevices acquires Intel cleanroom equipment, announces expansion

Rogue Valley Microdevices (RVM), a MEMS foundry service provider, announced this week that it has acquired cleanroom equipment from the 10,000 square foot decommissioned Intel facility in Colorado Springs, Colorado. The company said that it is planning a large expansion of its fabrication facilities.  Rogue Valley Microdevices currently operates a 13,000 square foot facility with a 2,500 square foot cleanroom.  This acquisition of Intel equipment will enable the expansion and upgrade the company's existing wafer fabrication facility.  RVM is already fully operational in a wide range of equipment in the 200 mm (8 inch) platform, and processes up to 10,000 wafers per month with substrate sizes ranging from two to eight inches.