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Vesper plans to disrupt MEMS microphones market

Intending to improve the smallest audio component found in smartphones, wearables and Internet of Things (IoT) devices, a new Boston based sensor company called Vesper has designed a microphone that it says will enhance consumers' acoustic experience with voice capture and sound recording.  Though such microphones are virtually invisible to consumers, the market for the highest-performance devices is huge: the research firm IHS predicts that it will reach $718 million by 2017.  Vesper says that its microphone technology offers the highest signal-to-noise ratio (SNR) in ultra-compact form factors for consumer microphones: 70 db SNR, which is one of the key determining factors in acoustic performance.  Vesper has reportedly raised $5 million from federal grants, Atlas Ventures, and an undisclosed customer.  The company's CEO Matt Crowley previously co-founded Sand 9, a MEMS based oscillator company.

Wafer level packaging for MEMS and IC applications

Advanced packaging, especially at the wafer level, is becoming increasingly important for MEMS and 3D stacking applications.  FlipChip International (FCI), based in Phoenix, Arizona, is one of the service providers in this segment.  FCI is an interesting company because they compete with larger players such as ASE and Amkor.  Plus, a big part of their operations is in China.  We recently spoke with David Wilkie, FCI’s President and CEO, about his company’s current activities and challenges, recent marketplace dynamics, business threats and opportunities, and competitive landscape.  David also discusses 2.5 and 3D packaging approaches based on through silicon via (TSV) and through glass via (TGV) substrate technologies.