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Tronics and Airbus Group partner on RF MEMS switch development

Tronics, a designer and manufacturer of nano and microsystems, and Airbus Group, a multinational aerospace and defense corporation, announced this week their partnership for the development of capacitive RF MEMS switches and circuits.  Under this agreement, Tronics accesses Airbus Group's patent portfolio through an exclusive license for the development of a technology platform for RF MEMS switches.  This platform will serve Airbus Group business units, as well as any other company wishing to manufacture nPnT switches or custom circuits, such as tunable filters, switch matrices and switched delay lines.

CEA-Leti demos MEMS fabrication on its 300mm production line

In what may be a first for the MEMS industry, CEA-Leti has manufactured micro-accelerometers on 300mm wafers, a development that could lead to significantly lower MEMS manufacturing costs.  Leti's fabrication platform, orignally developed with 200mm technology, is currently being transferred to an industrial partner.  Demonstration of this technology on 300mm wafers has shown promising results.  In addition to lowering costs, manufacturing MEMS with 300mm technology enables 3D integration using MEMS CMOS processes in more advanced nodes than on 200mm, and the use of through silicon vias (TSVs), which is already available in 300mm technologies.