MEMS manufacturing: comparison of ultrasonic and spin coating for photoresist deposition applications

As MEMS device topologies become more complicated, new photoresist deposition technologies will be needed.  We recently spoke with Bennett Bruntil, Director of Electronics and Advanced Energy at Sono-Tek Corporation, about his company's experience with ultrasonic coating techniques.  In this comprehensive interview, Bennett compares ultrasonic coating with traditional spin coating, and discusses market trends and emerging applications.  He also comments on the most challenging MEMS device topographies, as well as Sono-Tek's product development roadmap.