Axus Technology, a provider of CMP, wafer thinning, and wafer surface processing solutions for semiconductor applications, is working with Mosaic Microsystems to build the supply chain for thin glass and through-glass via (TGV) processing and heterogeneous microelectronic packaging. Overcoming the challenges of handling, thinning, and cleaning <200 um thick wafers cost effectively prior to metallization is a key element in providing a robust, scalable process. Mosaic’s thin glass solutions provide key performance characteristics such as low loss, CTE match, environmental stability, and cost-effectiveness particularly desirable for 5G applications, as well as for MEMS and sensors for the internet of things (IoT). The company’s proprietary temporary bond technology supports thin glass substrates during downstream processing. This thin glass handling technology allows the supply chain to leverage the existing infrastructure for next generation microelectronics and photonics applications.
Axus’s CMP systems and tools improve the polish performance of thin wafers by utilizing the Axus Crystal carrier, specifically designed for ultra-thin and fragile wafers, along with process development from the company’s foundry and development lab. Industry needs for glass wafers are being by processes that support bonding, debonding, and CMP of thin, fragile substrates.
Dan Trojan, President and CEO of Axus, commented, “The development of processes and fragile wafer handling capabilities for thin glass wafers that we’re supporting in our partnership with Mosaic Microsystems is something we’re truly excited about. We believe this development will result in compelling solutions to difficult challenges in this evolving and growing market. We and our customers are already deeply involved in these types of applications, as evidenced by several of our recent new product introductions. These include Crystal wafer carriers, Crystal load stations, and last-but-not-least our new, state-of-the-art CapstoneTMCMP system. We believe that all of these products are the best solutions available in the industry for these types of materials and applications.”
Aric Shorey, Vice President of Business Development at Mosaic Microsystems, commented, “We have been very pleased to work with Axus for our CMP and finishing needs and appreciate how they have seamlessly employed Mosaic’s Viaffirm™ temporary bond technology into their processes and been successful in finishing substrates as thin as 100 um from the start.”
Axus Technology is a recognized industry leader for equipment and process solutions for CMP, wafer thinning, and wafer cleaning applications. Axus enables companies of all sizes from startups to high volume manufacturers to test, develop, and implement leading-edge solutions, particularly for novel and emerging materials, process integration schemes, as well as products and applications. Equipment solutions include low cost-of-ownership entry-level tools to state-of-the-art high-volume manufacturing systems. Process testing, development, optimization, and scaling are supported by our process applications lab and foundry, which includes a full array of process equipment and supporting metrology, as well as staffed by the most experienced team in the industry. For more information, please visit www.axustech.com or contact Jim Kelly, Vice President of Sales and Marketing, at [email protected].
Mosaic Microsystems is a microelectronics and photonics packaging company located in Rochester, New York focused on enabling glass and other thin substrates as a platform material for a range of microelectronics and photonics applications including interposers, RF/mmW, MEMS, and sensors technologies. For more information, please visit www.mosaicmicro.com or contact Aric Shorey, VP Business Development, at [email protected].
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