MEMS Journal -- The Largest MEMS Publication in the World

MEMS foundry IMT receives majority investment from Cerium Technology

Innovative Micro Technology (IMT) announced this week a majority equity financing led by Cerium Technology, an investment firm focused on innovation in the IoT market. IMT is a well-established player in the design and manufacture of MEMS devices. MEMS technology leverages the precision and scale of semiconductor wafer manufacturing to make micro and nano scale structures on silicon or glass that significantly improve the performance of devices that perform physical functions. IMT is one of the leading independent MEMS manufacturers in North America, partnering with innovative system vendors and fabless device firms worldwide to create and sustain competitive advantage. Proceeds from the financing will be used to increase R&D investments in the company's standard process platforms, upgrade existing equipment, and to complete the installation of IMT's new 8-inch wafer fabrication line.

Printed sensors and electronics: development challenges and emerging applications

As new sensor technologies continue to proliferate in existing and emerging applications, one especially promising area is printed-electronic sensors. We recently spoke with Dan Brewer, Executive Director of Marketing and Intellectual Property at Brewer Science, an active participant and one of the early entrants into this technology segment. The privately held company is based in Rolla, Missouri and was founded by Dr. Terry Brewer in 1981. The company got its start in semiconductor materials and specifically in materials used in front-end processes. They still claim to hold the largest market share in anti-reflective coatings for semiconductors, and they produce 70-80 types of materials used in lithography processes. From front-end materials, the company expanded to back-end advanced packaging materials, and from there to printed electronics.

MEMS foundry SilTerra unveils monolithic PMUT on CMOS platform

SilTerra, a Malaysian CMOS and MEMS foundry services provider, this week unveiled a piezoelectric micromachined ultrasound transducer (PMUT) on CMOS platform for fingerprint sensing and medical imaging applications. According to the company, this unique process platform offers a monolithic solution and integrates the PMUT on top of the CMOS resulting in a single-chip solution. The PMUT is formed using a CMOS compatible piezoelectric materials and surface micro-machining techniques. Designers can choose any of the SilTerra's traditional CMOS, BCD, RF, and ultra low-power platforms in 180nm or 130nm nodes to build the PMUT on the top of these platforms. 

Micralyne showcases MEMS technology platforms for emerging sensing applications

The company will be showcasing standardized MEMS process technologies that advance the speed of commercialization of emerging sensing applications. Micralyne will be featuring MicraMOx, a MEMS process platform for highly miniaturized metal oxide gas sensors for environmental sensing applications. Localized gas sensing is critically important in industrial settings and in homes. Coupled with IoT use cases, miniaturized gas sensors enable economical and connected environmental sensing. Metal oxide gas sensors have been available for many years, but they required improvements in power consumption, cost, stability, and gas selectivity.

MEMS and sensors CAE startup OnScale raises $3 million, emerges from stealth mode

Emerging from stealth mode this week, OnScale announced $3 million in strategic seed funding and unveiled the industry's first solver-as-a-service platform that gives engineers the power to accelerate innovation in the $40 billion MEMS, sensors, 5G, biomedical, IoT, and automated car markets. OnScale was co-founded by CEO Ian Campbell, VP of Product Development Dr. Robbie Banks, and VP of Engineering Dr. Gerry Harvey as a spin-off from Thornton Tomasetti, a large science and engineering consulting company. The seed round was led by Thornton Tomasetti, with participation from Silicon Valley investors such as Michael Lehman, former CFO of Arista Networks, Palo Alto Networks, and Sun Microsystems, and CampbellKlein, an early stage high-tech venture fund.

MEMS foundry Micralyne introduces standardized microfluidic process technology

Micralyne, a manufacturer of biomedical MEMS and sensors, announced this week the launch MicraFluidics, a set of standardized microfluidic process technologies, to support demand from the biomedical and life-sciences industry for rapid design and deployment of integrated microfluidic based products. MicraFluidics features a variety of substrate options for biomedical customers such as silicon, glass, and silicon-on-insulator (SOI) with design flexibility for multi-level channels, electrode patterning for dielectrophoresis and embedded sensors, and choices of glass or silicon as input and output ports. This technology has been validated in a wide range of devices such as flow cells, biochips, labs-on-chip, cell sorters, separation and analysis devices, and high-pressure analytical chips.

Lam Research acquires MEMS software company Coventor for $137.6 million

In August of 2017, Lam Research completed the acquisition of Coventor, a MEMS modeling and simulation software company, for a total purchase consideration of $137.6 million. When asked about how Coventor fits into Lam’s portfolio, the company’s Executive VP and CFO Douglas Bettinger said that, potentially, there are benefits and synergies with Coventor’s software capability to model and simulate the actual output of Lam’s equipment. We recently spoke with Stephen Breit, Coventor’s Sr. Director of MEMS, and discussed the trends that he is seeing in the MEMS marketplace. Since Coventor works with many MEMS companies, we also asked Stephen about the notable startups and technologies.

MEMS foundry Novati acquired by Skorpios Technologies

Skorpios Technologies, a system on chip (SoC) specialist, announced this week that it has acquired Novati Technologies, a semiconductor and MEMS integration company whose fab is located in Austin, Texas.  The acquisition closed this week for an undisclosed amount.  This acquisition gives Skorpios the ability to better meet growing customer demand via vertical integration of its proprietary heterogeneous integration process by increasing volume throughput and allowing control of its critical supply chain.  Skorpios said that it expects to now have decreased fab cycle times by providing access to focused production lines in the foundry.  As a result, the company expects to have a faster time to market as well expediting development of new products, resulting in accelerated revenue realization.

Nanusens raises $2.1 million to develop NEMS devices in CMOS process

The company's NEMS based sensors are made using standard CMOS processes and mask techniques. In the Nanusens process, the inter metal dielectric (IMD) is etched away through the pad openings in the passivation layer using vapor HF (vHF) to create the nano-sensor structures. The holes are then sealed and the chip packaged as necessary. Because only standard CMOS processes are used, and the sensors can be directly integrated with active circuitry as required, the sensors can potentially have high yields similar to CMOS devices.  Nanusens claims that its process also results in nano-scale devices that overcome a major problem of MEMS inertial sensors, stiction, by two orders of magnitude by reducing the sensor size by an order of magnitude into the nano-realm.  We recently spoke with Josep Montanyà i Silvestre, the CEO of Nanusens.

MEMS foundry Micralyne partners with Microplex to deliver metal TSV wafers

Micralyne, a MEMS foundry and sensors supplier, announced this week a collaboration with Microplex based in Placentia, California to develop and manufacture custom wafers with metal TSVs. The joint development of this technology leverages the specific expertise of each company to enable a metal TSV solution for sensor and semiconductor applications. The companies engaged in the development of the TSV offering in 2016 and are now offering full volume production capability.