MEMS Journal -- The Largest MEMS Publication in the World

CEA-Leti demos MEMS fabrication on its 300mm production line

In what may be a first for the MEMS industry, CEA-Leti has manufactured micro-accelerometers on 300mm wafers, a development that could lead to significantly lower MEMS manufacturing costs.  Leti's fabrication platform, orignally developed with 200mm technology, is currently being transferred to an industrial partner.  Demonstration of this technology on 300mm wafers has shown promising results.  In addition to lowering costs, manufacturing MEMS with 300mm technology enables 3D integration using MEMS CMOS processes in more advanced nodes than on 200mm, and the use of through silicon vias (TSVs), which is already available in 300mm technologies.

MEMS foundry Tronics seizes sub-micron MEMS opportunities

Tronics has been manufacturing MEMS devices for 15 years with an emphasis on SOI and WLP, and has focused on specialized MEMS fabrication processes.  As such, the company said recently that it is capitalizing on the growing number of sub-micron MEMS devices opportunities to expand its equipment and process base.  According to Tronics, over the past two years the company has been acquiring advanced equipment and allocated significant resources to the development of sub-micron MEMS processes, which combine traditional MEMS structures and advanced nanotechnology parts.  There are a growing number of opportunities for sub-micron MEMS devices in optical, and also in inertial and microfluidics applications.

Wafer level packaging for MEMS and IC applications

Advanced packaging, especially at the wafer level, is becoming increasingly important for MEMS and 3D stacking applications.  FlipChip International (FCI), based in Phoenix, Arizona, is one of the service providers in this segment.  FCI is an interesting company because they compete with larger players such as ASE and Amkor.  Plus, a big part of their operations is in China.  We recently spoke with David Wilkie, FCI’s President and CEO, about his company’s current activities and challenges, recent marketplace dynamics, business threats and opportunities, and competitive landscape.  David also discusses 2.5 and 3D packaging approaches based on through silicon via (TSV) and through glass via (TGV) substrate technologies.

MEMS ecosystem in Korea: an overview of key companies and organizations

Even with the presence of the consumer electronics giant Samsung and a strong R&D community, Korea’s MEMS ecosystem remains quite small.  Among the top MEMS makers, not a single one is based in Korea.  However, because of Samsung’s increasingly strong presence in the consumer electronics business, as well as the country’s established high technology base, there may be compelling reasons for the Korean MEMS industry to grow in the near future.  GMEMS, a small MEMS foundry, claims to be the only commercial production facility in Korea.  We recently spoke with Dr. Scott Lee, the CEO of the company.  In this interview, Dr. Lee presents an overview of some of the key MEMS companies and organizations in Korea, as well as the history, current status, and vision of his company.

X-FAB expands MEMS manufacturing capabilities with two new dedicated MEMS fabs

X-FAB Silicon Foundries announced this week that it has reached a major milestone in further expanding its MEMS manufacturing capabilities in two of its German locations, Erfurt and Itzehoe.  According to the company, driven by increased customer demand for MEMS manufacturing services, the expansion includes two new dedicated MEMS fabs with cleanroom space totaling more than 2,000 square meters (21,500 square feet).  MEMS devices manufactured at X-FAB include pressure sensors, micro-mirrors, microphones and microfluidic devices used in mobile, consumer, medical and automotive applications.  Customers requiring CMOS and MEMS solutions also benefit from access to X-FAB's existing CMOS wafer fabrication facilities.

Silex continues to focus on TSV technologies, pure play MEMS foundry model

The marketplace for MEMS foundry services is getting increasingly more competitive and globalized.  Recently, large companies such as TSMC and GLOBALFOUNDRIES have been more aggressive in the MEMS space and, perhaps, are even subsidizing some projects to get more experience with the relevant process technologies.  At the same time, intellectual property (IP) protection is becoming even more important due to the commoditization of some MEMS devices, especially in the consumer electronics segment.  We recently spoke with Edvard Kälvesten, CEO of Silex Microsystems, to discuss his vision for the company, some of the recent changes that were made, his main concerns at this time, and the upcoming milestones for the company in the next few years.

MEMS foundry Rogue Valley Microdevices acquires Intel cleanroom equipment, announces expansion

Rogue Valley Microdevices (RVM), a MEMS foundry service provider, announced this week that it has acquired cleanroom equipment from the 10,000 square foot decommissioned Intel facility in Colorado Springs, Colorado. The company said that it is planning a large expansion of its fabrication facilities.  Rogue Valley Microdevices currently operates a 13,000 square foot facility with a 2,500 square foot cleanroom.  This acquisition of Intel equipment will enable the expansion and upgrade the company's existing wafer fabrication facility.  RVM is already fully operational in a wide range of equipment in the 200 mm (8 inch) platform, and processes up to 10,000 wafers per month with substrate sizes ranging from two to eight inches.

Smart sensors: packaging, testing, and reliability

by Randy Frank
President, Randy Frank & Associates

All the advances and research occurring in micromachining would lead one to believe that breakthroughs in these areas will be sufficient to revolutionize sensing.  Unfortunately, the problems associated with the basic sensor packaging are compounded when the sensor is combined with higher levels of electronics.  These problems initiate at the lowest level of die and wire bonding and extend to encapsulation, sealing, and lead forming issues. Fundamental assembly differences frequently exist between sensor and microelectronics packaging and are among the problems that are being solved to achieve smarter sensors.  These differences include die bonding for stress isolation instead of for heat dissipation and wire bonding procedures.

Tronics delivers its millionth high performance inertial MEMS sensor

After more than a decade in the business, Tronics has sold more than one million high performance inertial MEMS sensors. These products were primarily high-performance accelerometers and gyroscopes.  In markets where yearly volumes are typically in the thousands, one million is a significant number.  High-performance inertial MEMS have been one of Tronics key businesses for about 15 years.  The company has been involved in all aspects of the sensor products -- from MEMS design to MEMS manufacturing, through ASIC integration, packaging, test and calibration.

MEMS foundry Micralyne set to emerge from creditor protection

The company, based in Edmonton, Canada, announced this week that it is set to emerge from creditor protection in August 2013.  On July 9th, 2013, Micralyne held a vote with its creditors on the plan to emerge from creditor protection and the company's creditors reportedly voted overwhelmingly in support of the plan.  This sets the stage for court approval of Micralyne's plan for emergence for next week.  The action to seek protection in March 2012 was intended to protect the company's existing customer base, new customers, vendors and employees as Micralyne worked to overcome some business pressures created from a significant contraction of revenues.  We spoke briefly with Mike Ciprick, Micralyne's acting president and CEO.